Xiaomi unveils its fastest smartphone chip
What's the story
Chinese tech giant Xiaomi has unveiled its latest in-house smartphone processor, the Xring O3. The move comes as part of the company's strategy to have greater control over key components and reduce dependence on external chip suppliers. The new chip will be manufactured by TSMC using its 3nm technology.
Specs
About the chip
Developed in 459 days, the Xring O3 features a 10-core CPU offering 60% higher performance and a 16-core G2-Ultra NX GPU delivering an 85% graphics boost with 64% better efficiency.
Scoring 5.22 million points on AnTuTu, it is the first mobile SoC to pass the 5-million mark.
The chipset also introduces LPDDR6 support at 113.8GB/s bandwidth and provides distributed AI acceleration with 200 TOPS of tensor performance and a 45% faster NPU.
Strategic move
Successor to the Xring O1
The launch of the Xring O3 comes a year after Xiaomi introduced its first proprietary smartphone processor, the Xring O1.
This latest development marks another step in the company's journey to join tech giants like Apple, Samsung, and Huawei in developing their own chips.
The new chip is expected to power Xiaomi's upcoming flagship folding phone with a shipment target of between 200,000 and 300,000 units.
Previous success
Over 1 million devices shipped with Xring O1
Xiaomi's first proprietary smartphone processor, the Xring O1, has seen considerable success since its launch.
The company announced during an earnings call last week that cumulative shipments of devices powered by the Xring O1 had surpassed one million units. This includes smartphones, tablets, and watches.
However, it is worth noting that only some 150,000 smartphones based on this chip have been sold since May 2025.