TSMC and Amkor sign decade-long Arizona pact for AI packaging
Business
TSMC and Amkor just signed a 10-year deal to ramp up advanced semiconductor packaging and testing in Arizona.
The move is all about powering the latest artificial intelligence (AI) and high-performance computing technology, while making sure the US has a stronger, more reliable chip supply.
TSMC to tap Amkor CoWoS services
With this agreement, TSMC will tap into Amkor's cutting-edge packaging services, including chip-on-wafer-on-substrate (CoWoS) technology that is crucial for AI.
This partnership builds on their earlier plans from 2024 and fits right into TSMC's massive $165 billion investment in Arizona, which includes new factories, packaging centers, and a research and development hub to fuel the United States's semiconductor future.