Paras Semiconductors partners with BroadPak to boost packaging in India
Paras Semiconductors (from Paras Defence) is teaming up with U.S.-based BroadPak to level up semiconductor packaging in India.
Announced this week, the partnership mixes Paras's manufacturing push with BroadPak's know-how in advanced chip tech like 2.5-D/3-D integration and chiplets, basically helping India catch up with global demand for smarter, faster chips.
India OSAT to train semiconductor engineers
Together, they're setting up a cutting-edge assembly and testing center (OSAT) in India, focusing on next-generation chip packaging and integration.
The plan includes sharing technology and training local talent, so more engineers here can work on cool stuff like AI and high-performance computing.
As Paras Defence & Space Technologies Limited's managing director Munjal Sharad Shah put it, "Our entry into the semiconductor sector represents a strategic expansion into a technology domain that is increasingly critical to India's AI and data centers and industrial capabilities."